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STATS ChipPAC Ltd. is a leading service provider of semiconductor packaging design, bump, probe, assembly, test and distribution solutions. We have the scale to provide a comprehensive range of semiconductor packaging and test solutions to a diversified global customer base servicing the computing, communications and consumer markets.
We have a leadership position in providing advanced packages, such as flip chip, stacked die (SD), System-in-Package (SiP), as well as BGA packages and wafer level CSPs. We are also a leader in testing mixed-signal semiconductors or semiconductors combining the use of analog and digital circuits in a chip. Mixed-signal semiconductors are used extensively in fast-growing communications and consumer applications. We have strong expertise in testing a wide range of high-performance digital devices.
We have been successful in attracting new customers with our packaging and test capabilities and then expanding our relationship with such customers to provide full turnkey solutions tailored to their individual needs.Headquarters
10 Ang Mo Kio Street 65; #05-17/20 Techpoint
Singapore, Singapore 569059
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